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Intel’s Alder Lake-H debuts on Adlink modules

Adlink has unveiled the “Express-ADP” Type 6 and “COM-HPC-cADP” Client “B” modules based on the recently disclosed 12th generation Intel Alder Lake-H processors, with 16x PCIe Gen4 and 64 GB of DDR5. Seco, meanwhile, is preparing a COM-HPC Client “A” module.

Following Intel’s announcement of its 12th generation Alder Lake processors, starting with six high-end S-series desktop models, Benchleaks leaked some specifications from the Geekbench database in December, which revealed details of the most power-efficient mobile models, including the Alder Lake-P chips and the high-end Alder Lake-H series chips. Now, in anticipation of a full Alder Lake reveal by Intel in conjunction with this week’s CES virtual show, Adlink has announced two Alder Lake-H-based compute modules. Intel also has a preliminary product page on a Seco module.

COM-HPC-cADP architecture (left) and Intel 12th generation Alder Lake
(Click on the pictures to enlarge them)

Adlink Express-ADP uses COM Express Basic Type 6 form factor, and COM-HPC-cADP conforms to server class COM-HPC client size B. artificial vision, mammography, surgical robots, security or perimeter monitoring and access control.

Seco’s CHPC-D80-CSA uses the smaller COM-HPC Client Size A variant. Like the Adlink products, it supports Linux and Windows (see further below).

Like the 11th gen Tiger Lake processors, 12th gen Alder Lake uses a 10nm manufacturing process, in this case an “Enhanced SuperFin” design called Intel 7. 12th gen processors launch a hybrid architecture much like Arm’s Big.Little with basic multi-orchestration DynamIQ.

Alder Lake uses a combination of “Golden Cove” performance cores (P cores) and low power “Gracemount” efficient cores (E cores). The hybrid design provides more flexibility to accommodate single or multithreaded performance. There is also new Intel Thread Director technology that dynamically allocates real-time loads to the appropriate cores, although initially this will only be supported on Windows.

Like Tiger Lake, Alder Lake offers high-end graphics up to 96EU Iris Xe, as well as Intel Deep Learning Boost (DL-Boost) and Intel Advanced Vector Extensions 2 (AVX2) for AI acceleration on CPU and GPU cores. The 12th generation platform scales up to 4800 MT / s of DDR5 RAM and up to 16 PCIe Gen5 lanes, which offers up to twice the throughput of PCIe 4.0. Adlink modules, however, are sticking with PCIe Gen4, as it will be some time before PCIe Gen5 cards and modules become available. (For more details on Alder Lake, see our 12th Gen Intel report.)

Only one of the three Alder Lake-H models supported by Adlink is included in the Benchleaks list of seven models: the 14-core, 20-thread Core i7-12800HE. (The Seco does not list individual models.)

The Adlink SKUs are as follows:

  • Core i7-12800HE – 14 Alder Lake-H cores (6P + 8E / 20T); 24MB L3; 45 W TDP (35 W cTDP); Iris Xe GPU
  • Core i5-12600HE – 12 Alder Lake-H cores (4P + 8E / 16T); 18MB L3; 45 W TDP (35 W cTDP); Iris Xe GPU
  • Core i3-12300HE – 8 Alder Lake-H cores (4P + 4E / 12T); 12MB L3; 45 W TDP (35 W cTDP); UHD GPU

Adlink doesn’t list clock frequencies, but the Benchleaks report lists a base speed of 2.8 GHz for the Core i7-12800HE with 1,654 single-core and 9,619 multi-core performance scores. As noted in a TechRadar article on leaks, performance scores should be taken with some skepticism. The Benchleaks-based TechRadar charts (below) show an unusual mishmash of single-core and multi-core scores, with some models more optimized for multi-core than others.

In comparison, the initial Alder Lake desktop S-series lineup is led by the 16-core, 24-thread Core i9-12900K with rates of 30MB L3, 2.3GHz / 5.2GHz across all 8 cores. P and 2.4 GHz / 3.9 GHz on the 8x E-cores. Another benchmark is Intel’s Tiger Lake-H, which is led by an octa-core, 2.4GHz / 4.6GHz Core i7-11850HE with 45W TDP and 35W cTDP, which is available from the Basic Type 6 Express-TL from Adlink.

As usual with Intel, there is some brand confusion. Adlink’s ad and block diagrams refer to the chips as Alder Lake-P, but the PR also mentions Alder Lake-H. Elsewhere it is said that the chips were “formerly Alder Lake-P”.

Alder Lake-H (left) and Alder Lake-P processors (scores may be incorrect)
Source: TechRadar based on information from Benchleaks Geekbench database
(Click on the pictures to enlarge them)

According to this October HardwareTimes story, Intel had recently renamed its P-series mobile processors from U and H series. Meanwhile, the TechRadar report linked to above shows separate charts for Alder Lake-H and Alder. Lake-P. The P-series graph shows a similar core count to the H-series, but with lower L3 cache and lower base clock frequencies. It also lists the turbo rates, which are not displayed for the H-series. Hopefully Intel will sort this out for us in a few days.

Adlink Express-ADP

The Adlink Express-ADP 125 x 95 mm Basic Type 6 supports Win 10 and a Linux stack based on Yocto, with Ubuntu and VxWorks listed as “TBC”. Supported Intel technologies, based on SKU reference, include Intel VT, Intel HT, Intel SSE4.2, Intel 64 Architecture, Intel Turbo Boost 2.0, Intel AVX512-VNNI, Intel TXT, Execute Disable Bit, Intel Data Protection with Intel Secure Key and Intel AES-NI. Although Adlink’s three SKUs are listed as 45W TDP (35W cTDP), the datasheet also states that the processors support 15W / 28W / 45W TDP.

The Express-ADP supports up to 64 GB of dual channel DDR5 up to 4800 MT / s. The module provides Intel I225 series Ethernet controllers for GbE and 2.5 GbE, with a potential “TBC” build option for TSN.

Express-ADP Render Image and Diagram
(Click on the pictures to enlarge them)

Multimedia features include support for quad 4Kp60 display. The references Iris Xe, 8Kp60 for individual screens. There are 3 DDI interfaces for DP 1.4a, HDMI 2.0b and DVI. You also get a single / dual channel 18/24 bit LVDS with support up to HD, or alternatively via the build option, 4-way eDP 1.4b. There is also a build option to use one of the DDI links for an HD compatible VGA interface.

Up to two of the DDI interfaces can be converted to USB4 (USB 4.0) with support for DP 1.4a using the alternate display mode. There may also be a potential TBC option to convert DDI to Thunderbolt 4, a variant of USB4. The module also supports Realtek ALC886 audio on the optional Express-BASE6 carrier card

Expansion functions include PCIe x8 Gen4 (lanes 16-23), PCIe x4 Gen4 (24-27), PCIe x4 Gen4 (28-31), and 5x PCIe x1 Gen3 (0-3, configurable). There are two “build option by project” choices: a PCIe Gen3 lane 4 for an additional PCIe x1 (5-7) via a PCIe switch and an on-module NVMe SSD that replaces the PCIe lanes 28-31. There are also LPC, SMBus, and I2C extension interfaces, and “GP-SPI” is listed under the TBC status.

Other I / Os include 4x USB 3.2, 4x USB 2.0, 2x SATA III, 2x UART, and 12x GPIO. Super I / O is supported on the socket, and there is a TPM 2.0 chip. The module comes with Adlink’s SEMA board controller with watchdog etc. along with a 30 pin debug header.

The Express-ADP offers 8.5-20V AT or ATX input and ACPI 5.0 power management. Smart battery support is listed as TBC. The module is available in references from 0 to 60 ° C or -40 to 85 ° C and offers a relative humidity tolerance of 5 to 90% non-condensing. Shock and vibration resistance conforms to IEC 60068-2-64 and IEC-60068-2-27 standards.


The COM-HPC-cADP adopts the 120 x 120mm size B client form factor, which has been seen on modules such as Conga-HPC / cTLH based on Congatec’s Tiger Lake-H. Support for operating system and Intel technology is the same as on the Express-ADP, as is DDR5 up to 64GB.

Rear view and functional diagram COM-HPC-cADP
(Click on the pictures to enlarge them)

Like the Express-ADP, there are 2.5GbE and GbE controllers. There is also support for 2x NBASE-T, which allows 2.5 GbE over unshielded Cat5e (UTP) cable and 5 GbE over unshielded Cat6 (UTP) cable.

The COM-HPC-cADP provides 3x DDI, with two of the connections exchangeable into dual USB4 connections. There is also an eDP or a build options exchange for MIPI-DSI.

Audio support includes 2x Soundwire or 2x DMIC (TBC) plus a choice of HDA, I2S or a possible TBC option for 2x additional Soundwire. Unlike the Express-ADP, a 2x, 4-way MIPI-CSI interface is listed as TBC.

COM-HPC-cADP appears to support 2 standard Thunderbolt4 compatible USB4 interfaces in addition to optional DDI based USB4 dual links. You also get 2x USB 3.0, 4x USB 2.0, 2x UART, 12x GPIO, TPM 2.0, and Super I / O on the stand. A SEMA controller and 40-pin debugging interface are also available.

There are more PCIe Gen3 interfaces than on the Express-ADP. You get 16x PCIe Gen4 and 8x PCIe Gen3 plus LPC, SMBus, I2C and GP-SPI (to be confirmed). Again, some of the PCIe lanes can be used for an NVMe SSD. The characteristics of power and robustness are the same.


At the time of publication, the Seco site made no mention of the CHPC-D80-CSA module, which is featured on an Intel partner page. The module deploys Alder Lake-H using a 120 x 95mm COM-HPC Client Size A form factor.

Seco CHPC-D80-CSA render images
(Click on the pictures to enlarge them)

Preliminary specs include up to 64 GB of RAM, 2 GbE controllers, and support for 8x PCIe x1, 2x PCIe x4, and a single PCIe x8 link. (PCIe generation was not listed.) The CHPC-D80-CSA will support 4x USB 3.2 Gen1, 4x USB 2.0, and 4x USB Type-C interfaces.

More information

No pricing or availability information has been provided for Adlink’s Alder Lake or Seco CHPC-D80-CSA modules. More information can be found in Adlink’s announcement and on its Express-ADP and COM-HPC-cADP preview product pages.

More information about the Seco module can be found on the Intel page of the CHPC-D80-CSA.


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